The Glasgow city region has secured a transformative investment with the creation of the National Advanced Semiconductor Packaging and Integration Centre (NASPIC), a move hailed as a “major win” for Scotland’s innovation landscape.
£160 Million Investment to Power UK Tech Leadership
The £160 million initiative, funded by the UK Government and Glasgow City Region Innovation Zone (GCRIZ), will be located in Renfrewshire within the University of Strathclyde’s Advanced Net Zero Innovation Centre (ANZIC). The centre will enable “lab-to-scale” packaging of semiconductor components used in vital sectors such as AI, quantum computing, and photonics, significantly reducing lead times and increasing domestic supply chain resilience.
Hundreds of Jobs and Global Impact
The NASPIC is projected to create up to 300 skilled jobs and unlock an estimated £800 million in additional revenue for UK and international businesses. This facility will double the size of current cleanrooms and expand research capacity, helping the UK compete globally in a sector traditionally dominated by overseas manufacturing.
Professor Matt Boyle, Director of Electrification at the National Manufacturing Institute Scotland (NMIS), stated:
“We are building a world-class capability here in Glasgow, positioning the region at the forefront of advanced semiconductor development. Our ambition is to serve the global market for semiconductor packaging. As part of this, we also intend to develop skills programmes that will fuel the sector’s expansion both locally and nationally.”
On the centre’s impact, Professor Boyle added:
“This latest funding boost underlines NMIS’s commitment to becoming a world-leading centre for advanced manufacturing in these critical technologies. NASPIC will support companies looking to bring manufacturing in-house and reduce their reliance on overseas supply chains. With access to the broader expertise at the University of Strathclyde, the centre will offer a wafer-to-systems integration capability.”
“There is no other facility in the UK that offers the level of support and access to technology we are planning. This new national resource will be key to enhancing the UK’s position in a growing global market, nurturing businesses and enabling them to scale…
Scotland has long been at the forefront of semiconductor innovation. Now, with fresh momentum and investment, we have the opportunity to put Scotland back on the global map for advanced packaging, underpinned by targeted skills development.”
Professor Sir Jim McDonald, Principal and Vice-Chancellor of the University of Strathclyde and Chair of the NMIS Board, said:
“The development of the National Advanced Semiconductor Packaging and Integration Centre reflects Strathclyde’s scientific and technological strengths and our longstanding commitment to industrial innovation and research that delivers real-world impact. This is a strategically important capability for the UK, enhancing our competitiveness, strengthening supply chains, and opening up new opportunities in high-growth sectors such as AI, quantum, and photonics.”
By giving the UK a critical national resource for semiconductor packaging, NASPIC will reduce reliance on overseas suppliers, boost high-tech job creation, and ensure that the Glasgow city region continues to lead Europe’s tech resurgence.
